Application and operation of aluminum substrate

  Layout of aluminum substrate

　　 Aluminum based copper clad plate is a type of metal circuit board material, composed of copper foil, thermal insulation layer, and metal substrate. Its layout is divided into three layers:

　　Cireuitl Layer circuit layer: equivalent to the copper clad board of a typical PCB, with a copper foil thickness of loz to 10oz.

　　Dielcctric Layer Insulation Layer: The insulation layer is a low thermal resistance thermal insulation material. The thickness ranging from 0.003 "to 0.006" inches is the core design location for aluminum based copper clad panels and has obtained UL certification.

　　Base Layer: It is a metal substrate, usually aluminum or optional copper. Aluminum based copper clad panels and traditional epoxy glass cloth laminates.

　　The PCB aluminum substrate consists of a circuit layer, a thermal insulation layer, and a metal substrate. The circuit layer (i.e. copper foil) is usually formed by etching to form a printed circuit, connecting the various components of the component to each other. Generally, the circuit layer needs to have a large current carrying capacity, so thicker copper foil should be used, usually 35 thickμm~280μm；The thermal insulation layer is the core skill of PCB aluminum substrate. It is usually composed of special polymers filled with special ceramics, with low thermal resistance, excellent viscoelastic function, and the ability to resist thermal aging. It can withstand mechanical and thermal stress. The thermal insulation layer of high-performance PCB aluminum substrates such as T-101, T-111, T-112, T-113, T-114, T-200, T-300, T-400, T-500, T-600, etc. utilizes this skill to provide excellent thermal conductivity and high-strength electrical insulation; The metal substrate is the supporting component of an aluminum substrate, which requires high thermal conductivity. It is usually an aluminum substrate, and copper plates can also be used (in which copper plates can provide very good thermal conductivity), suitable for conventional mechanical processing such as drilling, punching, and cutting. PCB data comparison has advantages that cannot be compared with other data. Install SMT technology on the surface of suitable power components. No heat sink required, greatly reduced volume, excellent heat dissipation, outstanding insulation and mechanical functions.
 

　  Aluminum substrate usage

　　1. Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.

　　2. Power supply equipment: switch regulators, DC/AC converters, SW regulators, etc.

　　3. Communication electronic equipment: high-frequency amplifier, filtering device, and transmitting circuit.

　　4. Office automation equipment: electric motor drivers, etc.

　　5. Automobile: electronic regulators, igniters, power controllers, etc.

　　6. Computer: CPU board, floppy disk drive, power supply device, etc.

　　7. Power module: inverter, solid-state relay, rectifier bridge, etc.

　　8. Lighting fixtures: With the promotion of energy-saving lamps, aluminum substrates used for LED lights have also begun to be widely used.
 

      The characteristics of aluminum substrates

　　1. Use SMT (Surface Mount Technique);

　　2. Effectively handling thermal diffusion in circuit design;

　　3. Reduce the operating temperature of the product, improve the power density and reliability of the product, and extend the service life of the product;

　　4. Reduce product volume, lower hardware and installation costs;

　　5. Replace fragile ceramic substrates to achieve excellent mechanical durability.