The process flow of aluminum substrate

The process flow of aluminum substrate

1、 Cutting materials
　　

1. The process of cutting materials

Material requisition - cutting

2. The purpose of cutting materials

Cut large-sized incoming materials into the required dimensions for production

3. Precautions for cutting materials

① Check the size of the first piece after cutting

② Pay attention to aluminum surface scratches and copper surface scratches

③ Pay attention to the layering of board edges and the presence of sharp edges

2、 Drilling
　　

1. Drilling process

Pinning - Drilling - Inspection Plate

2. The purpose of drilling

Positioning and drilling holes on the board to assist in the subsequent production process and customer assembly

3. Precautions for drilling

① Verify the number of boreholes and the size of voids

② Avoid scratches on the sheet metal

③ Check the edge of the aluminum surface and the deviation of the hole position

④ Timely inspection and replacement of drill bits

⑤ Drilling is divided into two stages, one is drilling: after cutting, drilling becomes the peripheral tool hole

Second drill: tool hole inside the unit after solder mask welding

3、 Dry/wet film imaging
　　

1. Dry/wet film imaging process

Grinding plate - film application - exposure - development

2. Purpose of dry/wet film imaging

Present the parts required for making the circuit on the board

3. Precautions for dry/wet film imaging

① Check if there is an open circuit in the circuit after development

② Is there any deviation in the development alignment to prevent the occurrence of dry film fragmentation

③ Pay attention to poor wiring caused by scratches on the board surface

④ There should be no air residue during exposure to prevent poor exposure

⑤ After exposure, it is necessary to stand still for at least 15 minutes before proceeding with development

4、 Acid/alkaline etching
　　

1. Acid/alkaline etching process

Etching - Film Removal - Drying - Plate Inspection

2. Purpose of acidic/alkaline etching

After imaging the dry/wet film, retain the required circuit portion and remove any excess parts beyond the circuit

3. Notes on acidic/alkaline etching

① Pay attention to unclean etching and excessive etching

② Pay attention to line width and line thickness

③ The copper surface is not allowed to have oxidation or scratches

④ The drying film needs to be completely removed

5、 Screen printing solder mask, characters

1. Screen printing solder mask and character flow

Screen printing - pre baking - exposure - development - characters

2. The purpose of silk screen solder mask and characters

① Solder protection: protects circuits that do not require soldering, preventing tin from entering and causing short circuits

② Characters: serve as identifiers

3. Precautions for silk screen solder mask and characters

① To check for any debris or foreign objects on the board surface

② Check the cleanliness of the mesh board

③ After silk screen printing, it should be pre baked for more than 30 minutes to avoid the formation of bubbles in the circuit

④ Pay attention to the thickness and uniformity of silk screen printing

⑤ After pre baking, the board should be completely cooled to avoid contact with film or damage to the ink surface gloss

⑥ Place the ink surface downwards during development

6、 V-CUT, gong board
　　

1. V-CUT, gong board process

V-CUT - gong board - tear off protective film - remove sharp edges

2. The purpose of V-CUT and gong board

① V-CUT: Cut and connect a small portion of a single PCS circuit to the entire PNL board for easy packaging and removal for use

② Gong board: Remove excess parts from the circuit board

3. Precautions for V-CUT and gong board

① During the V-CUT process, attention should be paid to the size of V, as well as any imperfections or burrs on the edges

② Pay attention to causing burrs and skewed gongs when using gongs, and check and replace the gongs in a timely manner

③ Finally, it is important to avoid scratching the board surface when removing the sharp edges

7、 Testing, OSP
　　

1. Testing, OSP process

Circuit Test - Voltage Withstand Test - OSP

2. Purpose of testing and OSP

① Circuit testing: Check if the completed circuit is working properly

② Voltage withstand test: Check whether the completed circuit can withstand the specified voltage environment

③ OSP: Enable better soldering of circuits

3. Testing, precautions for OSP

① How to distinguish and store qualified and unqualified products after testing

② Placement after completing OSP

③ To avoid damage to the circuit

8、 FQC, FQA, Packaging, Shipping
　　

1. Process

FQC - FQA - Packaging - Shipping

2. Purpose

① FQC conducts full inspection and confirmation of products

② FQA sampling verification

③ Packaging and shipping to customers as required

3. Attention

① FQC pays attention to the confirmation of appearance during visual inspection and makes reasonable distinctions

② FQA conducts spot checks to verify the inspection standards of FQC

③ To confirm the quantity of packaging and avoid mixing, misplacing, and packaging damage