The circuit board factory tells you the difference between sinking gold and plating gold

           Gold plated circuit board and gold plated circuit board are commonly used processes in current circuit board production.

           With the increasing integration of ICs, the number of IC pins is also increasing. However, the vertical tin spraying process is difficult to blow flat the fine solder pads, which brings difficulty to SMT mounting; In addition, the standby life of tin foil is very short. And the gold-plated circuit board precisely solves these problems. For surface mount technology, especially for ultra small surface mount, the flatness of the solder pads directly affects the quality of the solder paste printing process and has a decisive impact on the quality of subsequent reflow soldering. Therefore, gold plating on circuit boards is often seen in high-density and ultra small surface mount processes. In the trial production stage, the influence of factors such as component procurement is often not that the board is soldered immediately upon arrival, but that it often has to wait for several weeks or even months before use. The standby life of circuit board gold-plated boards is many times longer than that of tin boards. So everyone is willing to adopt it. Besides, the cost of the gold plating sample stage is almost the same as that of lead tin alloy plates.
  
What is gold plating
        Gold plating refers to electroplated gold, electroplated nickel gold plate, electrolytic gold, electroplated gold, electroplated nickel gold plate, with the distinction between soft gold and hard gold (usually used as a gold finger). The principle is to dissolve nickel and gold (commonly known as gold salts) in chemical solution, immerse the circuit board in an electroplating cylinder and apply an electric current to generate a nickel gold coating on the copper foil surface of the circuit board. Electroplated nickel gold is widely used in electronic products due to its high hardness, wear resistance, and resistance to oxidation.
  
  What is sinking gold
        Gold deposition is a method of generating a layer of coating through chemical oxidation-reduction reactions, which is generally thicker. It is a type of chemical nickel gold deposition method that can achieve a thicker gold layer, commonly known as gold deposition.    

The difference between sunken gold plate and gold-plated plate

             1、 The crystal structure formed by gold plating on circuit boards is different from that of gold plating on circuit boards. Gold plating on circuit boards is much thicker than gold plating, resulting in a golden yellow color that is more yellow than gold plating, which satisfies customers more.
        2、 Compared to gold plating, sinking gold is easier to weld and will not cause poor welding, leading to customer complaints. The stress of the sinking gold plate is easier to control, which is more conducive to the processing of products with bonding. At the same time, it is precisely because sinking gold is softer than plating gold, that sinking gold plates are not wear-resistant when making gold fingers.
        3、 The sinking gold plate only has nickel gold on the solder pad, and the signal transmission in the skin effect is in the copper layer without affecting the signal.
        4、 Compared to gold plating, sinking gold has a denser crystal structure and is less prone to oxidation. Make process choices based on your own product needs   
        5、 As the wiring becomes denser, the line width and spacing have reached 3-4 MIL. Plating gold can easily cause short circuits in the gold wire. The sinking gold plate only has nickel gold on the solder pad, so there will be no gold wire short circuit.
        6、 The circuit board only has nickel gold on the solder pads, so the bonding between the solder mask and the copper layer on the circuit board is stronger. The engineering compensation will not affect the spacing
        7、 Generally used for boards with relatively high requirements and good flatness, circuit boards are generally used for gold plating, which generally does not result in black pads after assembly. The flatness and service life of the gold-plated plate are as good as those of the gold-plated plate.